hot fill hot melt
Futura H4048 is a new hot melt adhesive from Intercol that is able to bond hot filled products where other adhesives fail due to high temperatures and residual heat. As thi hot melt glue has a very fast speed of set, it is also resistant to shock loads immediately after bonding.
The new hotmelt adhesive ensures that bonds will not fail during either production, transport or storage, even when initial pack temperatures are as high as 75°C and temperatures in the centre of a pallet remain high up to a week.
The product is an addition to the Intercol's Futura range and is approved for direct food contact. Like other Futura hotmelt adhesive products, it is odourless, non-fuming, non-coaling, non charring, very clean running, and will not taint foodstuffs or other sensitive products.
Several manufacturers with hot packing products at 55 to 60°C using corrugated board enjoy the benefit of Intercol Futura H4048. The packs are safely placed in storage with a single glueing technology where it can take several days for the residual heat to dissipate. In the past a double glue technique was used: hotmelt for the fast setting, and a waterbased adhesive for the long term heat resistance. Using these two types of adhesive in one machine, challenged the production and technicians to keep te machine clean running and reach their high product efficiency.
4048 has a short open time, fast speed of set and high molten tack enables it to cope with short compression times – the end flap remains firmly sealed when long cartons, packed under high stress with heavy load, drop off the end of the production line.
While hot melts are widely used for in-line bonding at high speeds, they normally rely on rapid cooling to ambient temperature to gain strength.INtercol developed this high heat resitance hot melt to suit individual production processes in hot climates or where hot products are being packed.
Like all hotmelts in our Futura range, this hotmelt is also compatible with autofill and tankless hot melt adhesive systems.